Aluminum Printed Circuit Boards

PCB Solutions is a solid source for AL based Printed Circuit Boards. For High-Powered LEDs most customers use Aluminum based PCBs; for low-power LEDs standard FR4 PCBs are available as well. Our PCB fabrication specifications and build most types of metal based Printed Circuit Boards.

Aluminum Based PCBs are a unique metal-based copper clad laminate. These types of Printed Circuit Boards have good thermal conductivity, electrical insulation and very solid machining performance. These types of are typically fabricated with a metal base consisting of aluminum (most common) but can also be produced with copper.

An Aluminum Printed Circuit Board typically contains copper foil, thermal insulating layer and metal substrate, its structure divide into three layers:

1. Circuit layer: the equivalent of an ordinary PCB- copper thickness from 1oz to 10oz.
2. Insulation layer: Insulation is a layer of thermal insulating material with low thermal resistance. Thickness: 0.003 “to 0.006” inch is the aluminum PCB core technology.
3. Base Layer: a metal substrate, usually aluminum or copper.

Advantages and Features:

• Can easily be used for Surface Mount Technology (SMT)
• Assists with thermal diffusion of heat from LEDs
• Reduces product operating temperatures, increases the power density and reliability, and helps to extended product life
• Smaller footprint, lower hardware and assembly costs;
• Replaces fragile ceramic based pcbs, and has better mechanical durability

Item	MC PCB (Al base, Copper base, Iron Base
Finished thickness	0.2-6.5mm (Tlr.: +/- 10%)
Layers	1-8 layer
Min. Finished hole size	.06mm
Base Film thickness	/
Base Cu thickness	0.5-10 OZ
Finished Copper T.	0.5-10 OZ
Min. Space/Width	0.1mm/0.1mm
Max. Panel Size	1700mm*600mm
Break Down Voltage	1-5 kv ac
TC	0.3-10 w/mk
Min. Finished thickness	0.2mm
Material	Bergquist, Laird, Denka, Totking, ITEQ, YGA, Huangzheng, etc
Surface Finish	HASL, Lead Free HASL, OSP, Immersion Gold, Immersion Silver, Gold Fingers
Overlay thickness and Adhesive thickness	/
Additional Processes	Peeable mask, Carbon ink, Plated slots and edge, Counter sink, Blind & buried via, via in pad, isolated holes, blind and buried holes, black oxidation, silver jumper