Introduction
|
Production Capability |
| Item | Suzhou | Shenzhen |
|
Max. Working PNL Dimension |
510mm × 610mm | 510mm × 610mm |
|
Max. Layer Count |
6 Layers | 6 Layers |
| Min. Finished Board Hole Diameter |
Punching 0.7 mm NC 0.2 mm |
Punching 0.7 mm NC 0.2 mm |
| Finished Board Dimension Tolerance |
Punching ± 0.1mm Routing ± 0.15mm |
Punching ± 0.1mm Routing ± 0.15mm |
| Min. Width of Trace |
Inner Layer 0.1mm Outer Layer 0.15mm |
Inner Layer 0.1mm Outer Layer 0.15mm |
| Min. Board Thickness | 0.6mm | 0.6mm |
| Max. Board Thickness | 3.2mm | 3.2mm |
| Board Thickness Tolerance | ± 10% | ± 10% |
| Finished Hole Tolerance | PTH ± 0.075mm | NPTH ± 0.05mm |
|
Surface Treatment
|
OSP, HT OSP, HAL, LF HAL, Carbon, ENIG
Ni/Au Plating
|
|
|
Impedance Control |
± 10% | ± 10% |
|
Production Capability of Aluminum Based PCB
|
| Max. Dimension of Working Panel | 600 × 500 mm |
| Min. Dimension of Working Panel | 220 × 220 mm |
| Min. Width of Trace or Space | 0.2 mm |
| Min Diameter of Punching Hole | 0.2 mm |
| Finished Board Thickness | 0.6~ 2.6 mm |
| Finished Board Outline Tolerance |
0.1 mm ( Board Thickness <0.6) 0.15 (Board Thickness >0.8) |
| V-cut precision | ± 0.2m m |
| Hole position Tolerance | ± 0.1m m |
| Surface Treatment | OSP, HT OSP, ENIG, HAL, Lead Free HAL, Ni/ Au Plating |
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