Introduction
| 
					 Production Capability  | 
			
| Item | Suzhou | Shenzhen | 
| 
					Max. Working PNL Dimension  | 
				510mm × 610mm | 510mm × 610mm | 
| 
					 Max. Layer Count  | 
				6 Layers | 6 Layers | 
| Min. Finished Board Hole Diameter | 
					Punching 0.7 mm  NC 0.2 mm  | 
				
					Punching 0.7 mm  NC 0.2 mm  | 
			
| Finished Board Dimension Tolerance | 
					Punching ± 0.1mm  Routing ± 0.15mm  | 
				
					Punching ± 0.1mm  Routing ± 0.15mm  | 
			
| Min. Width of Trace | 
					Inner Layer 0.1mm  Outer Layer 0.15mm  | 
				
					Inner Layer 0.1mm  Outer Layer 0.15mm  | 
			
| Min. Board Thickness | 0.6mm | 0.6mm | 
| Max. Board Thickness | 3.2mm | 3.2mm | 
| Board Thickness Tolerance | ± 10% | ± 10% | 
| Finished Hole Tolerance | PTH ± 0.075mm | NPTH ± 0.05mm | 
| 
					 
						Surface Treatment 
					 
				 | 
				
					 
						OSP, HT OSP, HAL, LF HAL, Carbon, ENIG 
					 
					
						Ni/Au Plating 
					 
				 | 
			|
| 
					  Impedance Control  | 
				± 10% | ± 10% | 
| 
					 
						Production Capability of Aluminum Based PCB
					 
				 | 
			
| Max. Dimension of Working Panel | 600 × 500 mm | 
| Min. Dimension of Working Panel | 220 × 220 mm | 
| Min. Width of Trace or Space | 0.2 mm | 
| Min Diameter of Punching Hole | 0.2 mm | 
| Finished Board Thickness | 0.6~ 2.6 mm | 
| Finished Board Outline Tolerance | 
					0.1 mm ( Board Thickness <0.6)  0.15 (Board Thickness >0.8)  | 
			
| V-cut precision | ± 0.2m m | 
| Hole position Tolerance | ± 0.1m m | 
| Surface Treatment | OSP, HT OSP, ENIG, HAL, Lead Free HAL, Ni/ Au Plating | 
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